Special processing for substrates used in high-precision devices.
Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!
Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.
- Company：モリマーエスエスピー 本社
- Price：Other
